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Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g

SKU
TG-G15-02
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Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
More Information
SKU TG-G15-02
EAN 8716309102698
Specification
Features
TypeThermal paste
Density3.15 g/cm³
Constitutive ingredientsSilicone
Silicone percentage15%
Carbon percentage35%
Thermal resistance0.0087 °C/W
Viscosity note12500 Pa s
Thermal conductivity4.63 W/m·K
Operating temperature (T-T)-30 - 280 °C
Product colourGrey
CertificationRoHS, CE
Weight & dimensions
Width30 mm
Depth35 mm
Height30 mm
Weight24 g
Package width30 mm
Package depth35 mm
Package height30 mm
Package weight30 g
Packaging data
Package width30 mm
Package depth35 mm
Package height30 mm
Package weight30 g
Quantity per pack400 pc(s)
Technical details
Density3.15 g/cm³
Constitutive ingredientsSilicone
Silicone percentage15%
Carbon percentage35%
Thermal resistance0.0087 °C/W
Viscosity note12500 Pa s
Thermal conductivity4.63 W/m·K
Operating temperature (T-T)-30 - 280 °C
CertificationRoHS, CE
Operational conditions
Operating temperature (T-T)-30 - 280 °C
Colour
Product colourGrey
Logistics data
Country of originChina
Quantity per pack400 pc(s)
Manufacturer Gembird
Availability In Stock
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