The store will not work correctly when cookies are disabled.
JavaScript seems to be disabled in your browser.
For the best experience on our site, be sure to turn on Javascript in your browser.
Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
10.23
Details
Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive
More Information
More Information
SKU
TG-G3.0-01
EAN
8716309083133
Specification
Features Thermal resistance 0.205 °C/W Viscosity note 76 CPS Thermal conductivity 4.5 W/m·K Operating temperature (T-T) -50 - 240 °C Product colour Grey Technical details Compliance certificates RoHS Thermal resistance 0.205 °C/W Viscosity note 76 CPS Thermal conductivity 4.5 W/m·K Operating temperature (T-T) -50 - 240 °C Weight & dimensions Width 120 mm Depth 180 mm Height 15 mm Weight 3 g Package width 120 mm Package depth 180 mm Package height 15 mm Package weight 33 g Packaging data Package width 120 mm Package depth 180 mm Package height 15 mm Package weight 33 g Operational conditions Operating temperature (T-T) -50 - 240 °C Colour Product colour Grey
Manufacturer
Gembird
In Stock
Y
Meta Description
Heatsink thermal paste grease, 3 g weight
Reviews
Search engine powered by ElasticSuite